2026 WESEMiBAY closes in Shenzhen with 156,700 visitors and 1,000 exhibitors

The expo, themed “Chip Toward the Future, Intelligence Creates the Ecosystem,” was organized around four core exhibition areas: wafer manufacturing, compound semiconductors, advanced packaging, and IC design and AI infrastructure, the report said. It linked R&D and design, equipment and materials, manufacturing and packaging and testing, and system applications. A newly established AIE AI Infrastructure Industry Ecosystem Exhibition focused on applications in intelligent terminals, automotive electronics and the low-altitude economy, connecting chips, computing power and applications.

Exhibitors included ASML, Applied Materials, Lam Research, Tokyo Electron, KLA, NAURA, AMEC, ASM, Merck, ACM Research, Piotech, SCREEN, DISCO, CETC Equipment, Huatian Technology and Hwatsing, among others. In the AI infrastructure area, Shenzhen Smart City Group, Huawei, Qiyunfang and other companies displayed products and solutions in computing architecture, intelligent computing infrastructure, testing and measurement, and software tools.

The show served as a launch platform for 3,000 new products. Shanghai Micro Electronics presented its new advanced packaging lithography machine SSD820, supporting software and a displacement measurement interferometer. Founder Microelectronics launched SiC DIP32 power modules, including 1200V 35mΩ and 1200V 60mΩ products for on-board chargers, suspension electronic control and vehicle DC-DC power needs. Piotech introduced its NF-300M Flowable Carbon film deposition technology and equipment. AMEC promoted its Primo XD-RIE high-aspect-ratio etching equipment and Prefima Unicore AM 12-inch ALD molybdenum equipment. Qiyunfang launched an EDA system-level electronic design toolchain and a “Xiaolongxia” agent security solution. Changfei Advanced released high-performance SiC MOSFET chips and DeepXE embedded PCB power modules for the automotive main drive market, as well as PG4E single-tube series and EZ2C/3C module families for AI data centers.

In parallel, the 2026 Bay Area Semiconductor Conference held more than 40 forums across five core segments, including the opening summit, the Bay Area IC Science and Technology Conference, technical forums and high-level events. The event drew multiple academicians, 150 top scholars and more than 500 industry leaders, according to the report. Closed-door meetings of central and state-owned enterprise IC industry development and top-20 domestic and international executives discussed supply chain resilience, advanced process collaboration and opportunities in the AI era. The opening summit brought together government, industry, academia, research, application, capital and service representatives and jointly launched an industry ecosystem co-building initiative. The three-day science conference covered materials and new device principles, design and system integration, packaging and reliability testing, manufacturing and processes, future semiconductor intelligent manufacturing, and post-Moore frontier interdisciplinary topics; academicians including Mao Junfa, Huang Wei, Chang Ruihua and Shi Yi led sessions, with more than 70 academic reports from over 50 universities and research institutes.

The expo also arranged matchmaking. It invited 43 core wafer fabrication companies, including Hua Hong Semiconductor, CanSemi, GTA Semiconductor, Yangtze Memory Technologies, Wuhan Xinxin, Nexchip, ChangXin Memory Technologies and Silan Microelectronics, and drew more than 6,500 professional buyers. Nearly 50 supply chain, investment and procurement matchmaking events were held. Shenzhen Pinghu Laboratory signed strategic cooperation agreements with 20 industry partners to build a compound semiconductor industry-academia-research-application innovation ecosystem. CHIPX, together with TianTong, Liuxin Optoelectronics and Luceda, opened wafer-level manufacturing and tape-out services based on China’s first photonic chip pilot line. Turing Quantum signed strategic cooperation agreements with Shenzhen Smart City Computing Network Technology and Asia Computing Network and Quantum Computing Technology to build a Guangdong-Hong Kong-Macao quantum supercomputing heterogeneous computing platform. Silicon Core Technology and more than 10 organizations, including CR Micro, South China University of Technology and Guangdong University of Technology, initiated a Greater Bay Area 3D IC Advanced Packaging Innovation Center.

Organizers said the 2027 WESEMiBAY will expand to 100,000 square meters and use all nine halls of the Shenzhen Convention and Exhibition Center in Futian. More than 860 companies have pre-booked space, with pre-sold area exceeding 80,000 square meters and a booking rate of 80%, according to the report.

Editor's Summary

The 2026 WESEMiBAY closed in Shenzhen with 156,700 professional visitors, more than 1,000 exhibitors and 3,000 debut products. Across more than 40 forums, the event covered wafer manufacturing, advanced packaging, IC design and AI infrastructure, while matchmaking led to multiple cooperation agreements. Organizers said the 2027 edition will expand to 100,000 square meters, with 80% of exhibition space already pre-booked.