2026 WESEMiBAY Opens in Shenzhen with Over 1,000 Semiconductor Companies

The expo is held under the theme 'Chips Toward the Future, Smart Creation Ecosystem.' Its exhibition areas cover the full industrial chain, from EDA/IP, equipment and materials, and core components to manufacturing, packaging and testing, and computing applications. In addition to four core zones for wafer fabrication, compound semiconductors, advanced packaging and IC design/AI infrastructure, the event has set up an AI+3D IC Advanced Packaging Innovation Zone and a Third-generation Semiconductor National Technology Innovation Center Innovation and Industry Ecosystem Zone. A newly established AIE AI Infrastructure Industry Ecosystem Exhibition covers AI chips and computing architecture, intelligent computing centers, high-speed interconnect and green computing, presenting chip-computing coordination in one venue.

Exhibitors include ASML, Applied Materials, Lam Research, TEL, KLA, NAURA, AMEC, ASM, Merck, Shengmei Semiconductor, Piotech, SCREEN, DISCO, CETC Equipment, Hwatsing Technology, Edwards, FerroTec, Shanghai Micro Electronics, VAT, SMC, ESWIN, Jingsheng Electronics, Cobetter and Yoke Technology, according to the report. More than 1,000 domestic and overseas companies are displaying technologies and products in equipment, materials, components and manufacturing processes.

The opening ceremony included a joint new-product launch. Qiyunfang released what it described as China's first domestic EDA system-level electronic design toolchain. Hwatsing Technology launched a medium-current ion implanter. Changfei Advanced introduced a high-performance SiC MOSFET series that includes an 8-milliohm product, along with a self-developed embedded PCB power module. Leadmicro launched its iMagtron magnetron sputtering PVD system and a dedicated Ru ultra-thin-film ALD tool, covering ALD, CVD and PVD technologies. CETC Equipment released the Venus 6 advanced packaging metrology and inspection equipment, described as China's first tool able to simultaneously perform multi-process inspection for large glass substrate through-glass vias, or TGV, and redistribution layers, or RDL. Piotech presented Flowable Carbon, including Capi-Carbon and Sedi-Carbon. Shenzhen Pinghu Laboratory introduced what it called the world's first 8-inch GaN-on-SiC enhancement-mode high-electron-mobility transistor process platform.

Other first-day product launches took place at Hall 9, 9F17, where AMEC, Inovance and other leading and emerging companies presented new products, the report said. The first day also featured the opening ceremony and Semiconductor Industry Development Summit. The summit focused on AI application-driven chip design and semiconductor manufacturing industry development and market dynamics, and released China chip science progress. Yin Zhiyao, chairman and general manager of AMEC, proposed an initiative for joint development of the semiconductor industry ecosystem.

The Bay Area Integrated Circuit Science and Technology Conference brought together academicians Mao Junfa, Chang Ruihua and Guo Yongxin with academic and industry guests to discuss chip materials and devices, artificial intelligence, optical chips and AI empowerment. More than 10 technical forums covered wafer fabrication, compound semiconductors, advanced packaging, IC design and AIE AI infrastructure.

Before the expo, WESEMiBAY held matchmaking sessions in Beijing, Shanghai, Guangzhou, Wuxi, Hefei, Wuhan, Chengdu, Chongqing, Shenyang and other industry cluster cities. Professional visitors increased significantly over previous editions. About 80 percent of the more than 1,000 exhibitors came from outside Shenzhen. During the expo, supply chain procurement matchmaking, investment and financing roadshows, and dual recruitment and investment activities are intended to connect technology, industry and finance. Organizers aim to build a globally leading independent Chinese integrated circuit brand exhibition. On Oct. 15 and 16, the Third Bay Area Semiconductor Investment and Financing Strategic Development Forum, AIE Intelligent Computing Ecosystem Conference and Global Industry Analyst Forum will be held.