DeepX pursues first-mover strategy in physical AI with Intel, AMD partnerships

DeepX designs low-power, high-efficiency neural processing units (NPUs) for edge devices. NPUs are specialized processors for AI and machine learning workloads and are used in smartphones, laptops, robots, self-driving cars and smart factories. In an interview with Yonhap News Agency on Thursday, Kim said DeepX is in technical cooperation with Intel that includes integrating its NPUs into Intel's OpenVINO ecosystem and optimizing models and software development kits.

The partnership aims to provide a seamless plug-and-play experience when DeepX chips are connected to Intel systems, Kim said, adding that an initial outcome is expected early next year.

Founded in 2018, DeepX has developed four types of AI chip, including its flagship DX-M1, which has entered full-scale mass production using Samsung Electronics' 5-nanometer process. Kim, a former Apple engineer, said demand is growing at home and abroad as more companies seek to add AI to hardware such as smart glasses, autonomous vehicles and drones.

DeepX received 77 purchase orders from more than 10 countries in the 12 months from August 2025 to July 2026, according to Kim. The company has signed contracts with 27 semiconductor distributors worldwide, and about 300 entities, including more than 100 South Korean firms, are evaluating its products, he said. DeepX plans to open branches in Japan and Europe.

"We are pursuing a first-mover strategy to lead the global market by securing core source technologies in cutting-edge fields," Kim said, describing the company's ambition to "plant the first flag" in the emerging physical AI market.

DeepX is also in the early stages of pursuing business cooperation with U.S. chipmaker AMD after Kim met AMD CEO Lisa Su, who visited South Korea earlier this month. DeepX was among the South Korean AI chip companies invited to a roundtable with Su. During her visit, Su expressed AMD's willingness to build an open, heterogeneous computing infrastructure with the South Korean government and companies, combining different processors including graphics processing units and NPUs.

"I could see AMD's willingness to collaborate and build an open ecosystem with other companies in the field of physical AI," Kim said. "We also received an email from AMD's technical representative, saying they would conduct follow-up discussions." Kim said DeepX is discussing a possible partnership with AMD and preparing for further working-level talks.

On Samsung, Kim said DeepX plans to complete this month a tape-out of a chip designed using Samsung's 2-nanometer process. Tape-out is a key stage in semiconductor development when a finalized chip design is sent to a foundry for manufacturing. The first set of chips is expected around March or April next year, he said.

Kim also said DeepX plans to unveil DX-Newton, software for managing robot operations using physical AI, later this year. The software was developed to align its inputs and outputs with Nvidia's Isaac robotics development platform. "When the number of robots reaches thousands or tens of thousands, it becomes difficult to manage them by having humans install an AI model one by one," Kim said. "It's important to have a system where we can distribute new AI models through a network."

Asked about a potential initial public offering, Kim said a stock market debut is not DeepX's ultimate goal but that he hopes to take the company public within the next three years.