SK hynix showcases next-generation AI memory technologies beyond HBM at OCP Global Summit 2026
SK hynix showcased next-generation AI memory technologies at OCP Global Summit 2026, including MARS, High Bandwidth Flash progress and a second-generation 256GB CXL 3.2 product.
The company said it divided its exhibition space into two sections. The front section, called the memory section, displayed its flagship products. The larger rear section, called the system demo section, featured memory solutions designed to support next-generation server ecosystems.
Kim Ho-sik, a senior vice president at SK hynix, introduced MARS, or Memory-Centric AI Rack-Scale System, a disaggregated rack-scale architecture designed to coordinate computing and memory resources seamlessly. Kim also highlighted progress in High Bandwidth Flash, or HBF, a technology aimed at addressing the industry's growing demand for memory capacity.
SK hynix also unveiled its second-generation 256-gigabyte memory product based on Compute Express Link, or CXL, 3.2. The company said the product offers more than twice the bandwidth of its predecessor and an approximately 30 percent improvement in energy efficiency.
The OCP Global Summit is an annual conference organized by the Open Compute Project Foundation that brings together engineers and industry leaders. SK hynix used its exhibition to show memory products and system-level demonstrations intended for next-generation server ecosystems.