TheCUBE to Cover AI Data Pipeline Forum as Infrastructure Race Moves Beyond Chips
TheCUBE will livestream the AI Data Pipeline Forum in San Jose on Oct. 13, where industry leaders will discuss data movement, storage, memory, networking, power and cooling challenges in dense AI clusters. ScaleFlux, Dell, Cerebras, Cisco and others are expected to join.
TheCUBE Research Chief Analyst Dave Vellante recently identified memory constraints, data movement inefficiencies and inference economics as mounting challenges, with storage taking a more active role in the AI pipeline, SiliconANGLE reported. As inference workloads expand, the ability to move data efficiently through increasingly complex hardware environments is becoming a critical measure of AI infrastructure performance, the report said.
ScaleFlux Inc., which develops storage and memory controller technologies, is among the companies addressing data movement constraints as AI workloads become more memory-intensive. In July, ScaleFlux introduced PCIe Gen6 SSD and CXL memory controllers designed to increase throughput and memory capacity while managing power consumption, according to SiliconANGLE. Hao Zhong, co-founder and chief executive officer of ScaleFlux, said in the report: 'AI infrastructure is driving unprecedented demand for higher bandwidth, greater memory capacity, and lower power consumption. With the introduction of FC6116 and MC600, ScaleFlux is extending its silicon platform into the PCIe Gen6 era, giving customers the building blocks to design faster, more efficient, and more flexible storage and memory systems.'
Dell Technologies Inc. is also helping advance rack-scale architectures designed to accommodate growing compute density and operational requirements, SiliconANGLE reported. Sarat Krishnan, director of PowerEdge AI architecture and systems development engineering at Dell, said during a recent theCUBE interview: 'You have data centers that require cooling coming in from the top, cooling coming from the bottom. You have power whips of various sizes. We have learned now to build modular rack-scale infrastructure that can quickly adapt to all of these needs.'
The challenge extends beyond data movement, according to the report. Power delivery and cooling must also accommodate denser systems, making modular infrastructure and coordinated engineering increasingly important. The forum will address how open standards and modular designs can support the next generation of AI systems without introducing additional infrastructure bottlenecks.
During TheCUBE's coverage on Oct. 13, Furrier will host conversations with executives from ScaleFlux, Cerebras, Cisco, Dell and others about how the industry is addressing AI infrastructure bottlenecks through advances in storage, memory, high-speed networking, liquid cooling and power distribution. The conversations will also address how open standards and modular designs can support dense AI clusters and distributed inference. TheCUBE's coverage will be available on its dedicated website and YouTube channel, and on demand after the live event, according to SiliconANGLE.