SK hynix breaks ground on $4 billion HBM packaging plant in US
SK hynix broke ground on a $4bn US HBM plant; South Korea also announced AI projects, military drills, and JTBC rehabilitation.
Yonhap reported that the plant is expected to produce hundreds of thousands of wafers annually and will focus on high bandwidth memory (HBM), a critical component of advanced chips that power AI. This will be SK hynix's first next-generation HBM production hub in the United States.
In another development, Yonhap reported that the science ministry selected three consortia led by SK Telecom Co., KT Corp. and Kakao Corp. to build a government-backed AI service. The three teams will receive a total of 512 Nvidia B200 graphics processing units, with government budgets covering the cost of launching the service next year.
According to Yonhap, the Joint Chiefs of Staff said Friday that South Korea, the United States and Japan will conduct their trilateral Freedom Edge exercise from Sept. 7-11 in international waters east and south of Jeju Island.
A Gallup Korea poll, reported by Yonhap, showed President Lee Jae Myung's approval rating at 42 percent, down 3 percentage points from the previous week and the lowest since his inauguration. The survey of 1,001 adults came amid negative public assessment of the government's real estate policy.
Yonhap also reported that the Seoul Bankruptcy Court approved broadcaster JTBC's request to begin rehabilitation proceedings. JTBC had filed for rehabilitation on June 15, three days after failing to repay 20.6 billion won (US$14.9 million) in asset-backed loans.