TSMC reportedly to mass produce 1.6nm chips by late 2026
TSMC reportedly finished development of its 1.6nm A16 process and may start mass production in late 2026.
The report says TSMC has completed development and verification of its A16 (1.6nm) process. The process uses the company's Super Power Rail (SPR) backside power delivery network, which separates signal and power wiring by placing power on the back of the wafer. This separation reduces bottlenecks during data transmission, according to the report, and boosts computing speed and energy efficiency.
Compared with TSMC's 2nm architecture, the 1.6nm process is said to deliver an 8% to 10% increase in computing speed, a 15% to 20% decrease in energy consumption, and 8% to 10% higher chip density. The report adds that TSMC plans to use the 1.6nm node as a stepping stone to its 1.4nm process, with mass production targeted for 2028.
The news follows IBM's recent demonstration of a sub-nanometer architecture. IBM estimates it will take about five years before that design is ready for production, leaving TSMC and other manufacturers to race ahead with their own next-generation nodes.